Table of Contents

Editorial

Jianhong Zhang, Chenghe Dong

Article ID: 4659
Views - 44  (Abstract) PDF - 6  (Download)
 
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21-22

Articles

Victor Zavodinsky, Olga Gorkusha, Alexander Kuzmenko

Article ID: 4420
Views - 88  (Abstract) PDF - 28  (Download)
Abstract: The authors fulfilled calculations of the total energy and electronic states of CdnSen nanoparticle:“wurzite”, “sphalerite” and “rock-salt” types of the structure. It was shown that at n ≤ 72 the “rock-salt” type is the most favorable energetically. However the extrapolation of the behavior of the energy per Cd-Se atomic pair shows that fo...
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1-7
Mario Di Cino, Feng Li

Article ID: 4474
Views - 115  (Abstract) PDF - 24  (Download)
Abstract: Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing (HVM) maturity. In this paper,flip-chip and wire bonding are compared, then flip-chip bonding techniques are compared to examine advantages for scaling ...
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8-13

Review

Pratit Raj Giri, Gajendra Sharma

Article ID: 4619
Views - 72  (Abstract) PDF - 14  (Download)
Abstract: The data and internet are highly growing which causes problems in management of the big-data. For these kinds of problems, there are many software frameworks used to increase the performance of the distributed system. This software is used for the availability of large data storage. One of the most beneficial software frameworks used to utilize data in di...
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14-20